Obsnap Instruments Sdn Bhd
29A, Jalan SS 15/4C, 47500 Subang Jaya, Selangor, Malaysia.
+603-5621 5786
+603-5621 5829
+60122185651 (Enquiry)
+60162233687 (Vacancy)
Die / Wire Inspection Handler
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Main Function:
· Auto loader/unloader for substrate or lead frame
· Perform automated die-attach inspection & defect classification of inspected die
· Substrate map creation/updates or inking of defect dies
· Statistical descriptive analysis of defects
Vision Inspection Options:
· Device check
· Die Centering position/offset inspection
Silver epoxy coverage inspection
Features:
· High-resolution and high-precision X-Y table
· Multiple inspection stations
· Auto marking for rejects
· Window platform with user-defined specifications
· Built-in calibration feature
· Auto-generation of GR&R report
Library based uploading for different types of die
· Auto loader/unloader for substrate or lead frame
· Perform automated die-attach inspection & defect classification of inspected die
· Substrate map creation/updates or inking of defect dies
· Statistical descriptive analysis of defects
Vision Inspection Options:
· Device check
· Die Centering position/offset inspection
Silver epoxy coverage inspection
Features:
· High-resolution and high-precision X-Y table
· Multiple inspection stations
· Auto marking for rejects
· Window platform with user-defined specifications
· Built-in calibration feature
· Auto-generation of GR&R report
Library based uploading for different types of die
