Obsnap Instruments Sdn Bhd
29A, Jalan SS 15/4C, 47500 Subang Jaya, Selangor, Malaysia.
+603-5621 5786
+603-5621 5829
+60122185651 (Enquiry)
+60162233687 (Vacancy)

Thick 800A Plating Thickness Analyser

Previous 1 / 2 Next

Thick 800A Plating Thickness Analyser Plating Thickness Elemental Analysis

Add Quotation

This product is supplied by our sister company : JS Analytical Sdn Bhd
If you want to view original post, click here.
General Info

The Thick800A XRF Analyser is designed for rapid and non-destructive analysis of plating layer thickness and compositions of plating and plating solutions. Some features of the Thick 800A include:

  • Top lighting for easier measurement of samples of differing thickness.
  • Auto-height sample positioning with laser guiding.
  • Auto spot search for precise test point alignment.
  • Precision positioning sample holder.
  • Micro Collimator for improved testing accuracy.
  • Point and click by mouse test point determination.


Altitude Transducer.

Si-PIN Semiconductor Detector.

Measurement of up to 5 plating layers.

Micro collimator to improve testing accuracy.

Elements:     Na to U (more than 24 simultaneously).
Content Range:   1 ppm – 99.99%.
Repeatability:  0.1%
Long period stability: 0.1%
Dimensions:   648 x 490 x 544 mm
Sample Chamber:    517 x 352 x 150 mm


Please leave your enquiry here, we will reply as soon as possible.
Company Name  
Product Interested  
Contact No.*  
Ship to Name  
Shipping Address  
*only support gif, jpeg, jpg, png, pdf

You have 0 items in you cart. Would you like to checkout now?
0 items
Switch to Mobile Version
available in
Subscribe Newsletter