Thick 800A Plating Thickness Analyser Plating Thickness Elemental Analysis Malaysia, Selangor, Kuala Lumpur (KL) Supplier, Suppliers, Supply, Supplies

General Info

The Thick800A XRF Analyser is designed for rapid and non-destructive analysis of plating layer thickness and compositions of plating and plating solutions. Some features of the Thick 800A include:

Top lighting for easier measurement of samples of differing thickness.
Auto-height sample positioning with laser guiding.
Auto spot search for precise test point alignment.
Precision positioning sample holder.
Micro Collimator for improved testing accuracy.
Point and click by mouse test point determination.

Specifications

Altitude Transducer.

Si-PIN Semiconductor Detector.

Measurement of up to 5 plating layers.

Micro collimator to improve testing accuracy.

Elements:	Na to U (more than 24 simultaneously).
Content Range:	1 ppm – 99.99%.
Repeatability:	0.1%
Long period stability:	0.1%
Dimensions:	648 x 490 x 544 mm
Sample Chamber:	517 x 352 x 150 mm

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