Obsnap Instruments Sdn Bhd
29A, Jalan SS 15/4C,
47500 Subang Jaya,
Selangor, Malaysia.
+603-5621 5786
+603-5621 5829

Thick 800A Plating Thickness Analyser

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Thick 800A Plating Thickness Analyser Plating Thickness Elemental Analysis

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This product is supplied by our sister company : JS Analytical Sdn Bhd
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General Info

The Thick800A XRF Analyser is designed for rapid and non-destructive analysis of plating layer thickness and compositions of plating and plating solutions. Some features of the Thick 800A include:

  • Top lighting for easier measurement of samples of differing thickness.
  • Auto-height sample positioning with laser guiding.
  • Auto spot search for precise test point alignment.
  • Precision positioning sample holder.
  • Micro Collimator for improved testing accuracy.
  • Point and click by mouse test point determination.

Specifications


Altitude Transducer.

Si-PIN Semiconductor Detector.

Measurement of up to 5 plating layers.

Micro collimator to improve testing accuracy.

Elements:     Na to U (more than 24 simultaneously).
Content Range:   1 ppm – 99.99%.
Repeatability:  0.1%
Long period stability: 0.1%
Dimensions:   648 x 490 x 544 mm
Sample Chamber:    517 x 352 x 150 mm

 


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