Obsnap Instruments Sdn Bhd
29A, Jalan SS 15/4C, 47500 Subang Jaya, Selangor, Malaysia.
+603-5621 5786
+603-5621 5829
+60122185651 (Enquiry)
+60162233687 (Vacancy)
Thick8000 XRF (Plating Thickness Analyzer)
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This product is supplied by our sister company : JS Analytical Sdn Bhd
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General Info
Thick 8000 Plating Thickness X-Ray Fluorescence Spectrometer is specifically designed plating thickness measurement.
Skyray Microspot technology utilises a 3D movable platform, two HD cameras and 8 automatic collimators to achieve precise analysis with spot size as small as 0.1 mm.
Features
- Excellent sample observation system
- Advanced image identification
- Built-in SNE (Signal to Noise Enhancer)
- Intelligent Plating-thickness software
- Large area high resolution detector
- Four automatic micro-focus collimators
- One-click operation
Application Fields
- Metal plating thickness analysis
- PCB industry
- Electroplating industry
TECHNICAL SPECIFICATIONS |
|
|---|---|
| Measurable elements: | Sulfur ( S ) - Uranium ( U ) |
| Plating Thickness: | up to 20um |
| Repeatability: | 0.1% |
| Stability: | 0.1% |
| Energy Resolution: | 135eV |
| Power: | AC 220V ± 5V or AC 110V ± 5V. AC purified voltage power supply |
| Sample chamber size: | 52cm x 40cm x 15cm |
| Size: | 69cm x 57cm x 66cm |
| Work Temperature: | 15℃ -30 ℃ |
