Obsnap Instruments Sdn Bhd
29A, Jalan SS 15/4C,
47500 Subang Jaya,
Selangor, Malaysia.
+603-5621 5786
+603-5621 5829

Thick8000 XRF (Plating Thickness Analyzer)

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Thick8000 XRF (Plating Thickness Analyzer) Plating Thickness Elemental Analysis

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This product is supplied by our sister company : JS Analytical Sdn Bhd 
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General Info

Thick 8000 Plating Thickness X-Ray Fluorescence Spectrometer is specifically designed plating thickness measurement.

Skyray Microspot technology utilises a 3D movable platform, two HD cameras and 8 automatic collimators to achieve precise analysis with spot size as small as 0.1 mm.

Features
  • Excellent sample observation system
  • Advanced image identification
  • Built-in SNE (Signal to Noise Enhancer)
  • Intelligent Plating-thickness software
  • Large area high resolution detector
  • Four automatic micro-focus collimators
  • One-click operation
Application Fields
  • Metal plating thickness analysis
  • PCB industry
  • Electroplating industry
TECHNICAL SPECIFICATIONS
Measurable elements: Sulfur ( S ) - Uranium ( U )
Plating Thickness: up to 20um
Repeatability: 0.1%
Stability: 0.1%
Energy Resolution: 135eV
Power: AC 220V ± 5V or AC 110V ± 5V. AC purified voltage power supply
Sample chamber size: 52cm x 40cm x 15cm
Size: 69cm x 57cm x 66cm
Work Temperature: 15íŠ -30 íŠ

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